Reflow & Wave Soldering

SMT Reflow Oven – Specifications

Interactive structure and process

Reference specifications

Heating zones
12 (6 upper, 6 lower)
Maximum PCB width
300 mm
Temperature range
Ambient to 300 °C

Final configuration is subject to Feixing’s quotation.

Download specification sheetPDF
SMT Reflow Oven · Exploded illustration
Exploded illustration

Interactive structure and process

Structural illustration

Component details

Select a component to see what it does.

Operating sequence

After the temperature zones reach their setpoints, the mesh conveyor accepts the board at the left inlet.

Operation simulation video

A 3D animation showing the machine’s operating sequence.